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Material Science & Nanotechnology
Thin Film Measurement
Non-contact Sheet Resistance Sensor EddyCus TF Inline
Non-contact sheet resistance and layer thickness measurement solutions for process control
Brand: Suragus
Contact Us for better pricing.
Warranty Details
Advantages
- Non-contact real time measurement
- High measurement speed up to 1,000 measurements/ sec.
- Fixed sensor installation or traversing sensor installation
- Integration of 1 – 99 monitoring lanes per system
- Process control at atmosphere or in vacuum
- Measurements very close to the edge of the substrate are possible in many applications
- Long term stability by temperature compensated measurements in changing environment
- Large distances to the testing material (eg. gap of 60 mm / 2.4 inch)
- Characterization of covered conductive layers or encapsulated substrates
- Numerous software integrated analysis and statistic functions
- Easy set up by EddyCus RampUp software incl. wizard for system calibration
- Wear- free
Measurement applications
- Sheet resistance measurement of 0.1 mOhm/sq up to 1 kOhm/sq
- Determination of the layer thickness of metal layers from 2 nm – 2 mm
- Layer thickness measurement of metal foils
- Measurement of the residual moisture in wet layers by non-contact permittivity measurement
Processes
- Deposition (PVD, ALD, (PE)CVD, electroplating, printing, spraying etc.)
- Ablation/ structuring (etching, polishing, laser etc.)
- Doping/ Implantation
- Tempering/ AnnealingDrying/ Heating
Applications
- Architectural glass (LowE layers)
- Packaging materials
- Displays and touch screens
- Photovoltaics
- Mirror coatings
- Capacitors
- OLEDs and LEDs
- Smart glass
- Metal layers and wafer metallization
- De-icing and heating
- Batteries and fuel cells
- Coated paper and conductive textiles
- Graphene layers
- Antibacterial coatings
Motivation for the use of inline metrology
- Process optimization/ control for fast and homogeny deposition
- Efficient layer stack according to the functionality (e.g. high transparency and low resistivity, good emissivity, good barrier properties)
- Increasing of the layer homogeneity especially on large substrates
- Optimization of the processing time and machine utilization
- Optimization of material input / usage (sputter target)
- Planning of maintenance cycles („predictive maintenance“)
- Quality assurance
Additional Options
- Standardized and customized measurement bridges
- Determination of electrical anisotropy
- Hardware trigger 5/12/24 V or 4-20 mA
- Integrated temperature measurement
- Integrated optical sensors for the determination of the optical transparency/ density (OEM)
- Integrated distance measurement by ultrasound, laser triangulation or capacitive sensors (OEM)
Setups
- Traversing sensor vs. fixed sensor installation
- At atmosphere or in vacuum (ex-vacuo/ in-vacuo)
Specification :
| Sheet resistance and metal film thickness measurement technology | Non-contact eddy current sensor |
| Substrates | e.g. foils, glass, wafer |
| Measurement gap size | 1 / 5 / 10 / 15 / 25 / 50 mm (other on request) |
| Number of sensor pairs/monitoring lanes | 1 – 99 |
| Substrate thickness measurement for non-conductive substrates | Ultrasonic, capacitive or optical sensor on request |
| Conductive layers | Metals/TCOs/CNTs/nanowires/graphene/grids/other |
| Sheet resistance range covered by every sensor | 0.0001 – 10 Ohm/sq < 2 % accuracy |
| 10 – 100 Ohm/sq < 3 % accuracy | |
| 100 – 1.000 Ohm/sq < 5 % accuracy | |
| Environment | < 60°C/ 140°F (on request < 90°C/ 194°F) |
| Sample rate | 1 / 10 /50 /100 /1,000 measurement per second |
| Thickness measurement of metal films (e.g. Al, Ag, Mo, Ag paste) | 2 nm – 2 mm (in accordance with sheet resistance) |
| Other integrated measurements | Metal thickness / optical transparency /densitiy / electrical anisotropy |
| Other integrated available features | Hardware trigger / DMC or bar code reader |
