Electron Beam Evaporation System NEE-4000

The Electron Beam Evaporation System is available in two different configurations. A compact vertical dual chamber configuration features a 14" cube main chamber where the platen is located, and underneath the main chamber a secondary chamber is provided for housing the e-beam source. This configuration can be provided with a gate valve between the two chambers to be used as a load lock to keep the e-beam source and the evaporation pockets in vacuum while substrates are loaded and unloaded from the main chamber. For applications where automatic loading and unloading of wafers are needed, a third load lock chamber is attached to the left face of the cube for another load lock. In this case, the main chamber can be kept at low 10^-7 Torr range at all times and evaporation can start just a few minutes after loading the wafer. The second configuration features a single large chamber design that allows e-beam evaporation guns, magnetrons, and thermal evaporation mounted onto the baseplate. In this configuration coating of mulitple wafers are possible using planetary substrate holder.

Features

• Electropolished 14” cubical or 21”x21”x22” 304L SS chamber
• 5x10^-7 Torr base pressure attained with turbomolecular pumping package
• 4x 15cc pocket E-gun
• Source and substrate shutters
• 6kW and 10kW switching power supply
• Automatic pocket indexing
• Programmable sweep controller
• 26” x 44” footprint with SS panels for Class 100 cleanrooms
• Quartz crystal thickness sensor
• Substrate rotation
• LabVIEW user interface
• EMO protection and safety interlocks

Applications

• Lift Off
• Optical Coatings
• Thin Film Transistors
• Active CIGS layer
• Josephson Junctions

Options

• Substrate heating up to 800°C or cooling
• Glancing Angle Deposition (GLAD) with rotation
• Planetary substrate holder
• Substrate RF/DC bias
• Dual e-beam source for co-evaporation
• Ion source for substrate cleaning and ion assisted evaporation
• Additional PVD sources (thermal, sputtering)
• MFC’s for reactive evaporation
• Automatic load/unload