Our high - quality, all NPP POLOS single wafer spin coaters are specifically designed for R&D and low volume production in the MEMS, Semiconductor, PV, Microfluidics field, etc. Suitable for all typical spin processes: cleaning, rinse/dry, coating, developingand etching.
The low-cost SPIN150i spin coater is suitable for processing fragments as small as 5 mm up to Ø150 (or 6”) or 4" x 4" substrates. Detachable touchpanel. Unlimited Program Storage for recipes with multiple steps each (CW & CCW rotation for puddle spin coating applications.)
Spin processor for cleaning, drying, coating, developing and/or etching of up to Ø 160 mm substrates
Full-Plastic System in Natural Polypropylene (NPP)
Table-Top Model for manual or automated (optional) chemical dispense
Transparent Lid with syringe holder for central dispensing
Electro-magnetic safety lid lock
Detachable controller interface for easy integration
N2 diffuser for N2 purge during process.
Easy, step- by- step recipe programming via large colour touchscreen.
Unlimited Program Storage for recipes with multiple steps / each for:
Time 0.1-99999 sec/step
Speed 0-12,000 rpm **
Rotation direction (CW, CCW, puddling)
Acceleration /Deceleration 1-30,000 rpm/sec.**,selectable per step
Vacuum On /Off
3 Programmable Dry Contacts: e.g. for automated control of Dispense unit, Nitrogen diffuser, etc.
Structured and password protected recipe storage for easy and safe management
Digitally controlled Motor with digital incremental speed signal feed back
Includes: (1) standard Vacuum Chuck
A-V36-S45-PP, Ø45 mm for up to Ø 6“ wafers D-V10-S50-PP, Small Fragment Adapter for Ø ½“- Ø 2’’ Pieces and Fragments (Alternative Chucks optionally available)